Dongbo Wang, H. K. Kannojia, P. Jouy, E. Giraud, G. Van Steenberge, B. Kuyken
{"title":"基于Ge-on-Si平台的中红外双梳qcl集成波束合成器","authors":"Dongbo Wang, H. K. Kannojia, P. Jouy, E. Giraud, G. Van Steenberge, B. Kuyken","doi":"10.1109/SiPhotonics55903.2023.10141936","DOIUrl":null,"url":null,"abstract":"Mid-infrared dual-comb spectroscopy, a powerful fast and broadband technique involves two combs that are mixed by free-space beam combining and generating beat signal. Here, we demonstrate for the first time on-chip QCLs integrated with combiners by leveraging Ge-on-Si platform and 3D self-alignment flip-chip assembly.","PeriodicalId":105710,"journal":{"name":"2023 IEEE Silicon Photonics Conference (SiPhotonics)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform\",\"authors\":\"Dongbo Wang, H. K. Kannojia, P. Jouy, E. Giraud, G. Van Steenberge, B. Kuyken\",\"doi\":\"10.1109/SiPhotonics55903.2023.10141936\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Mid-infrared dual-comb spectroscopy, a powerful fast and broadband technique involves two combs that are mixed by free-space beam combining and generating beat signal. Here, we demonstrate for the first time on-chip QCLs integrated with combiners by leveraging Ge-on-Si platform and 3D self-alignment flip-chip assembly.\",\"PeriodicalId\":105710,\"journal\":{\"name\":\"2023 IEEE Silicon Photonics Conference (SiPhotonics)\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE Silicon Photonics Conference (SiPhotonics)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SiPhotonics55903.2023.10141936\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Silicon Photonics Conference (SiPhotonics)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SiPhotonics55903.2023.10141936","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform
Mid-infrared dual-comb spectroscopy, a powerful fast and broadband technique involves two combs that are mixed by free-space beam combining and generating beat signal. Here, we demonstrate for the first time on-chip QCLs integrated with combiners by leveraging Ge-on-Si platform and 3D self-alignment flip-chip assembly.