等温电磁高加速测试方法对铜的大马士革线

Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) Pub Date : 2002-07-12 DOI:10.1109/IPFA.2002.1025631

Kin Leong, Y. Andrew, B. H. Lim, E. Chua, Y. K. Lim, Suat Cheng, Khoo Sherry

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引用次数: 1

摘要

晶圆级等温(ISOT)测试是一种用于互连电迁移(EM)评估的高加速测试，具有缩短测试时间和节省成本的优点。确定了铜(Cu) damascense线的ISOT试验活化能和物理失效模式。在这些方面与长期封装级EM测试进行了比较，强调了重要的相似之处。在广泛的测试温度范围内，ISOT活化能是一致的，没有观察到温度梯度对线路失效的显著影响。关键词scopper，等温，电迁移

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Isothermal em as highly accelerated test method for copper damascene lines

Wafer level Isothermal (ISOT) test is a highly accelerated test for interconnect electromigration (EM) evaluation, giving benefits of shorter test time and cost savings. Activation energy and physical failure modes of ISOT tests are determined for Copper (Cu) damascene lines. Comparisons are made with long term package level EM test in these aspects, emphasizing the important similarities. ISOT activation energy is consistent over a wide range of test temperatures studied and no significant influence of temperature gradients induced line failures is observed. KeywordsCopper, Isothermal, Electromigration

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Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)

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