完全耗尽和部分耗尽SOI mosfet的低温有效沟道迁移率

J. Wang, N. Kistler, J. Woo, C. Viswanathan, P. Vasudev
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引用次数: 1

摘要

研究了部分耗尽和完全耗尽的绝缘体上硅mosfet在300 ~ 77 K温度下的低场有效迁移率。采用薄膜厚度为1800 AA、埋层厚度为3500 AA的SIMOX晶圆制备晶体管。部分耗尽装置在低温下表现出更大的改善。这两种薄膜器件的迁移率基本上与倒置电荷密度无关,表明对垂直电场的依赖性较弱。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low temperature effective channel mobility in fully depleted and partially depleted SOI MOSFETs
The low-field effective mobility was studied for partially depleted and fully depleted silicon-on-insulator MOSFETs at temperatures from 300 K to 77 K. The transistors used in the study were fabricated on SIMOX wafers with a film thickness of 1800 AA and a buried oxide thickness of 3500 AA. The partially depleted device shows a greater improvement at low temperature. The mobility in both thin-film devices is essentially independent of inversion charge density, indicating a weak dependence on perpendicular electric field.<>
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