用于mmic的多层封装技术

Proceedings of IEEE Antennas and Propagation Society International Symposium Pub Date : 1993-06-28 DOI:10.1109/APS.1993.385177

M. Ida, T. Nishikawa

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引用次数: 4

摘要

介绍了三种封装技术。MCF(多层陶瓷框架)单腔封装在ka波段表现出优异的性能。先进的MCF多腔封装具有26 GHz接收机的高性能。用BAS基板制作的微波多芯片模块(MCM)显示了l波段放大器的高性能。

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A multilayered package technology for MMICs

Three packaging technologies are introduced. An MCF (multilayer ceramic frame) single-cavity package shows high performance to Ka-band. An advanced MCF multiple-cavity package exhibits high performance of 26 GHz receiver. A microwave MCM (multichip module) made of BAS substrate demonstrates high performance of the L-band amplifier.<>

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Proceedings of IEEE Antennas and Propagation Society International Symposium

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