一种自动检查集成电路键的方法

Proceedings Third International Conference on Computational Intelligence and Multimedia Applications. ICCIMA'99 (Cat. No.PR00300) Pub Date : 1999-09-23 DOI:10.1109/ICCIMA.1999.798524

Hyoung K. Lee, Suk I. Yoo

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引用次数: 2

摘要

VLSI电路封装密度的持续增加要求检测过程完全自动化。本文提出了一种自动检测焊丝与芯片上焊盘连接部位的新方法。一种流行的键合类型(连接到键合垫)被称为“球键合”。虽然已经介绍了几种球粘结检查方法，但它们并没有显示出有效的结果。该方法分为五个步骤:(1)利用二项滤波和改进拉普拉斯滤波对边缘进行增强;(2)图像二值化;(3)提取球键中心点;(4)提取球键边界;(5)直接对椭圆进行特定拟合。实验结果表明，与传统的球键检测方法相比，该方法可以更快、更准确地进行球键检测。此外，我们的方法从包含球部分的键合图像中找到球的大小和方向。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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An automated method for inspection of IC bonds

The continuing increase in packing density of VLSI circuits requires that the inspection process be completely automated. The paper suggests a new method for automatic inspection of that part of the wire bond where the wire connects to the bond pad on the chip. A popular type of bonding (connected to bond pad) known as "ball bond" is considered. Although several approaches for ball bond inspection have been introduced, they do not reveal efficient results. The suggested method consists of five steps: (1) enhance the edges using Binomial and the modified Laplace filter; (2) binarize the image: (3) extract center point of the ball bond; (4) extract the ball bond boundary; (5) fit the ellipse using direct ellipse-specific fitting. Experimental results illustrate that the proposed method performs the inspection of ball bond more fast and accurately as compared to the conventional ball bond inspection methods. In addition, our method finds the size and orientation of the ball from the bond image containing the part of the ball.

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Proceedings Third International Conference on Computational Intelligence and Multimedia Applications. ICCIMA'99 (Cat. No.PR00300)

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