航天器用金属基板导体在脉冲电流下的加热分析

A. V. Kostin
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引用次数: 0

摘要

本文介绍了脉冲电流通过航天器上金属底座上的印制板时,印制板导体发热的分析结果。研究了由印刷导体和印刷电路板组成的系统的热瞬态和脉冲特性。分析了印刷导体的温升速率和瞬态过程持续时间与系统元件线性尺寸的关系。文中指出,瞬态过程的时间与绝缘材料层的厚度有很大的关系。所有结果都是在ANSYS 2019 R1瞬态热模块的瞬态建模过程中获得的。给出了在印刷电路板设计中考虑印刷导体热瞬变的实用建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of heating of printed circuit board conductors on a metal base for spacecraft devices at pulsed current
The article presents the results of the analysis of heating of printed circuit conductors of printed circuit boards mounted on a metal base, on-board device of spacecraft when pulsed current flows through them. Thermal transient and impulse characteristics of a system consisting of a printed conductor and a printed circuit board are considered. The analysis of the dependence of the temperature rise rate of printed conductors and the duration of transient processes on the linear dimensions of the system elements is given. It is noted in the article that the time of transient processes most strongly depends on the thickness of the layer of insulating materials. All the results were obtained in the process of modeling transients in the ANSYS 2019 R1 Transient Thermal module. Practical recommendations on the consideration of thermal transients in printed conductors in the design of printed circuit boards are given.
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