超越32nm的摩尔定律:器件扩展的未来挑战

K. Kuhn
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引用次数: 77

摘要

本文探讨了32纳米技术节点之后的制程所面临的挑战,并推测了需要哪些新的解决方案。比较了平面和多栅极器件所面临的挑战。电阻和电容的挑战,回顾了过去的历史和正在进行的研究。讨论了高k金属栅极(HiK-MG)、衬底和沟道取向以及NMOS和PMOS应力等关键增强剂与未来晶体管一代的挑战有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Moore's Law Past 32nm: Future Challenges in Device Scaling
This paper explores the challenges facing process generations past the 32 nm technology node and speculates on what new solutions will be needed. The challenges facing planar and multiple-gate devices are compared and contrasted. Resistance and capacitance challenges are reviewed in relation to past history and on-going research. Key enhancers such as high-k metal-gate (HiK-MG), substrate and channel orientation, as well as NMOS and PMOS stress are discussed in relation to the challenges of the coming transistor generations.
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