高可靠性FC-PBGA

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI:10.1109/IEMT.1996.559696

Y. Ishida, T. Katoh, S. Ishiwata, A. Omura, T. Oohara

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引用次数: 4

摘要

本文研究了FC-PBGA(倒装芯片-塑料球栅阵列)的高可靠性问题。虽然倒装芯片技术在手表组装方面经验丰富，具有成本优势，但手表的芯片尺寸太小，不能直接适用于高可靠性的FC-PBGA。考虑到FC技术在FC- pbga中的应用，为降低应力而改变凹凸结构将是有效的。对于这一变化，研究了三个步骤:(1)将FC组件应用于外围凸起结构，(2)在芯片上建立再分布结构，(3)将FC技术应用于区域阵列凸起结构。本文报道了第一步的结果，即FC装配在外围碰撞中的应用。凹凸结构确保了在-40℃30分钟/125℃30分钟条件下的热疲劳抵抗3000次循环。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High reliable FC-PBGA

This paper is concerned with the high reliability of FC-PBGA (Flip Chip-Plastic Ball Grid Array). While flip chip technology is experienced in watch assembly and has a cost advantage, the chip sizes for watches are too small and not directly applicable to high reliable FC-PBGA. Considering the application of FC technology to FC-PBGA, the bump structure change for lower stress will be effective. For this change, three steps have been under examination: (1) application of FC assembly to peripheral bump structure, (2) establishment of re-distribution structure on chip, and (3) application of FC technology to area array bump structure. The result of the first step, application of FC assembly to peripheral bumping is reported in this paper. The bump structure has ensured a thermal fatigue resistance 3,000 cycles under the condition -40 C 30 min/125 C 30 min.

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Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

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