基于精确温升监测的新型量热功率晶体管软开关损耗测量

D. Neumayr, M. Guacci, D. Bortis, J. Kolar
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引用次数: 24

摘要

现代GaN和SiC功率半导体需要新的实验方法来确定开关损耗,因为广泛接受的双脉冲测试(DPT)由于WBG器件的快速开关所施加的电测量限制而无法准确捕获开关转换期间的耗散能量。本文提出了一种新的量热测量原理,该原理依赖于所附功率半导体的铝散热器在连续工作时的温升监测。与传统的量热法不同,一次测量可以在几分钟内完成。利用所提出的测量原理,对选定的600 V GaN、SiC和Si功率晶体管的软开关性能进行了评价。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New calorimetrie power transistor soft-switching loss measurement based on accurate temperature rise monitoring
Modern GaN and SiC power semiconductors require new experimental methods for determining switching losses as the widely accepted double-pulse-test (DPT) fails to accurately capture the dissipated energy during a switching transition because of electrical measurement limitations imposed by the very fast switching of WBG devices. In this paper, a new calorimetric measurement principle which relies on temperature rise monitoring of an aluminum heat sink during continuous operation of the attached power semiconductor is presented. Unlike traditional calorimetric methods, a single measurement can be performed in minutes. Using the proposed measurement principle, a soft-switching performance evaluation of selected 600 V GaN, SiC and Si power transistors is provided.
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