芯片城堡堆叠温度建模工具HotSpot 6.0的扩展

Tomohiro Totoki, M. Koibuchi, H. Amano
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引用次数: 0

摘要

HotSpot是一个开源的分析工具,用于估计二维和三维芯片堆栈的温度。它计算了通过散热器的主要传热路径和通过印刷电路板的次要传热路径。它可以估计芯片的温度。然而,HotSpot-6.0不能处理复杂的芯片堆叠,如带有感应无线耦合芯片接口(TCI)的芯片城堡(CoC)。因此,在本报告中,我们扩展了HotSpot模拟器并对其进行了更新,以便评估CoC。与原始HotSpot相比,HotSpot的扩展版本在评估相同的垂直堆叠时平均执行时间增加了约6%。芯片数相同时,CoC的执行时间比垂直堆叠时短,但层数相同时,执行时间几乎相等。此外,我们的设计考虑了高生产率,例如可以轻松设置风冷,油冷,水冷评估和芯片旋转设置。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Extension of A Temperature Modeling Tool HotSpot 6.0 for Castle-of-Chips Stacking
HotSpot is an open source analysis tool for estimating temperature of both 2D and 3D chip stacks. It counts both the primary path of the heat transfer through the heat-sink and the secondary path through the print circuit board. It can estimate the temperature of chips. However, HotSpot-6.0 cannot treat a complicated chip stacking such as the castle of chips (CoC) with inductive wireless coupling through-chip interface (TCI). Therefore, in this report we have extended the HotSpot simulator and updated it in order to evaluate CoC. Compared to the original HotSpot, the extended version of HotSpot had an average execution time increase of about 6% when evaluating the same vertical stacking. The execution time of CoC with the same number of chips is shorter than when executing vertical stacking, but when the number of layers is the same, the execution time is almost equal. Moreover, our design considers high productivity, e.g. it can easily set air cooling, oil cooling, water cooling evaluation and chip rotation setting.
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