S. Magoshi, H. Niiyama, S. Sato, Y. Kato, Y. Watanabe, T. Shibata, M. Ito, A. Ando, T. Nakasugi, K. Sugihara, K. Okumura
{"title":"改进的电子束/ DUV级内混配作为生产可行的100纳米分辨率光刻技术","authors":"S. Magoshi, H. Niiyama, S. Sato, Y. Kato, Y. Watanabe, T. Shibata, M. Ito, A. Ando, T. Nakasugi, K. Sugihara, K. Okumura","doi":"10.1109/IMNC.1998.729947","DOIUrl":null,"url":null,"abstract":"1. Jnwoduction The electron(e)-beam / deep ultraviolet (DUV) “intra-level” mix-and-match (ILM&M) strategy proposed by several groups [ 1,2,3] is an attractive concept to increase the throughput of the ebeam direct write (EBDW), while keeping its superior resolution. Nevertheless, in order that the LM&M may play important role in production of leading edge devices in the near future, the throughput and the overlay accuracy must be improved drastically. We propose an improved ILM&M as a production viable lithography featuring a D W biased exposure and a scanning DUV stepper without h igh rde r components of the image field distortion. The proposed ILM&M has been successfully applied to development and early production of leading edge devices in our laboratory.","PeriodicalId":356908,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Improved Electron-Beam / DUV Intra-Level Mix-and-Match As A Production Viable Lithography With 100-nm Resolution\",\"authors\":\"S. Magoshi, H. Niiyama, S. Sato, Y. Kato, Y. Watanabe, T. Shibata, M. Ito, A. Ando, T. Nakasugi, K. Sugihara, K. Okumura\",\"doi\":\"10.1109/IMNC.1998.729947\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"1. Jnwoduction The electron(e)-beam / deep ultraviolet (DUV) “intra-level” mix-and-match (ILM&M) strategy proposed by several groups [ 1,2,3] is an attractive concept to increase the throughput of the ebeam direct write (EBDW), while keeping its superior resolution. Nevertheless, in order that the LM&M may play important role in production of leading edge devices in the near future, the throughput and the overlay accuracy must be improved drastically. We propose an improved ILM&M as a production viable lithography featuring a D W biased exposure and a scanning DUV stepper without h igh rde r components of the image field distortion. The proposed ILM&M has been successfully applied to development and early production of leading edge devices in our laboratory.\",\"PeriodicalId\":356908,\"journal\":{\"name\":\"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)\",\"volume\":\"50 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-07-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMNC.1998.729947\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMNC.1998.729947","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improved Electron-Beam / DUV Intra-Level Mix-and-Match As A Production Viable Lithography With 100-nm Resolution
1. Jnwoduction The electron(e)-beam / deep ultraviolet (DUV) “intra-level” mix-and-match (ILM&M) strategy proposed by several groups [ 1,2,3] is an attractive concept to increase the throughput of the ebeam direct write (EBDW), while keeping its superior resolution. Nevertheless, in order that the LM&M may play important role in production of leading edge devices in the near future, the throughput and the overlay accuracy must be improved drastically. We propose an improved ILM&M as a production viable lithography featuring a D W biased exposure and a scanning DUV stepper without h igh rde r components of the image field distortion. The proposed ILM&M has been successfully applied to development and early production of leading edge devices in our laboratory.