{"title":"用于s参数预测的二维谱转置卷积神经网络","authors":"Yiliang Guo, Xingchen Li, Madhavan Swaminathan","doi":"10.1109/EPEPS53828.2022.9947109","DOIUrl":null,"url":null,"abstract":"In packaging problems, S-parameter predictions are necessary. Machine learning methods lead to dimensionality related challenges which we address here through spectral trans-posed convolutional neural network using 2D kernels. Results show that Normalized Mean-squared Error (NMSE) dropped 0.002 by using 53.7% of the parameters.","PeriodicalId":284818,"journal":{"name":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"2D Spectral Transposed Convolutional Neural Network for S-Parameter Predictions\",\"authors\":\"Yiliang Guo, Xingchen Li, Madhavan Swaminathan\",\"doi\":\"10.1109/EPEPS53828.2022.9947109\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In packaging problems, S-parameter predictions are necessary. Machine learning methods lead to dimensionality related challenges which we address here through spectral trans-posed convolutional neural network using 2D kernels. Results show that Normalized Mean-squared Error (NMSE) dropped 0.002 by using 53.7% of the parameters.\",\"PeriodicalId\":284818,\"journal\":{\"name\":\"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS53828.2022.9947109\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS53828.2022.9947109","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
2D Spectral Transposed Convolutional Neural Network for S-Parameter Predictions
In packaging problems, S-parameter predictions are necessary. Machine learning methods lead to dimensionality related challenges which we address here through spectral trans-posed convolutional neural network using 2D kernels. Results show that Normalized Mean-squared Error (NMSE) dropped 0.002 by using 53.7% of the parameters.