{"title":"贸易政策委员会联合主席的致辞","authors":"Binbin Chen, Ziling Zhou, Yuda Zhao","doi":"10.1109/smartcomp52413.2021.00006","DOIUrl":null,"url":null,"abstract":"We are excited to introduce the technical program for the first-ever ACM SIGCOMM conference held in India. This year’s program continues SIGCOMM’s tradition of presenting outstanding work that breaks new theoretical ground and provides practical insight into modern communication networks. The program committee accepted 33 excellent papers selected from 276 reviewed submissions. The topics range across all aspects of network infrastructure, from the enterprise and data center to wireless, and address problems and opportunities across the network stack from the physical layer to global social networks. Similarly, the papers came from a rich mix of authors from both academia and industry all over the world. Authors from over 30 countries submitted papers, and the final program includes authors from 8 countries and over 40 organizations.","PeriodicalId":330785,"journal":{"name":"2021 IEEE International Conference on Smart Computing (SMARTCOMP)","volume":"46 14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Message from the TPC Co-Chairs\",\"authors\":\"Binbin Chen, Ziling Zhou, Yuda Zhao\",\"doi\":\"10.1109/smartcomp52413.2021.00006\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We are excited to introduce the technical program for the first-ever ACM SIGCOMM conference held in India. This year’s program continues SIGCOMM’s tradition of presenting outstanding work that breaks new theoretical ground and provides practical insight into modern communication networks. The program committee accepted 33 excellent papers selected from 276 reviewed submissions. The topics range across all aspects of network infrastructure, from the enterprise and data center to wireless, and address problems and opportunities across the network stack from the physical layer to global social networks. Similarly, the papers came from a rich mix of authors from both academia and industry all over the world. Authors from over 30 countries submitted papers, and the final program includes authors from 8 countries and over 40 organizations.\",\"PeriodicalId\":330785,\"journal\":{\"name\":\"2021 IEEE International Conference on Smart Computing (SMARTCOMP)\",\"volume\":\"46 14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Conference on Smart Computing (SMARTCOMP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/smartcomp52413.2021.00006\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Conference on Smart Computing (SMARTCOMP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/smartcomp52413.2021.00006","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We are excited to introduce the technical program for the first-ever ACM SIGCOMM conference held in India. This year’s program continues SIGCOMM’s tradition of presenting outstanding work that breaks new theoretical ground and provides practical insight into modern communication networks. The program committee accepted 33 excellent papers selected from 276 reviewed submissions. The topics range across all aspects of network infrastructure, from the enterprise and data center to wireless, and address problems and opportunities across the network stack from the physical layer to global social networks. Similarly, the papers came from a rich mix of authors from both academia and industry all over the world. Authors from over 30 countries submitted papers, and the final program includes authors from 8 countries and over 40 organizations.