N. Mazor, R. Wizenberg, J. Oredsson, P. Svalange, P. Lundborg, T. Melander, Z. Nadiri, N. Chayat
{"title":"毫米波和超宽带CMOS 65nm SoC雷达应用","authors":"N. Mazor, R. Wizenberg, J. Oredsson, P. Svalange, P. Lundborg, T. Melander, Z. Nadiri, N. Chayat","doi":"10.1109/COMCAS44984.2019.8958142","DOIUrl":null,"url":null,"abstract":"A System on Chip (SoC) solution for ultra-wideband (UWB) and mm-wave MIMO radar applications is presented. The RFIC is implemented in a standard CMOS 65 nm process, comprising 24 transmit-receive modules for UWB along with 48 transmit-receive modules for mm-wave frequencies. Targeting radar applications, the signal generation architecture supports a variety of waveforms. The receive side includes multichannel digitization, memories and DSP processor for radar signal processing. The SoC family has several variants, supporting the 76-81 GHz band for automotive industry and a 57-71 GHz band for smart home applications. The die area is 83 mm$^{2} and it is packaged in a flip-chip BGA package.","PeriodicalId":276613,"journal":{"name":"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mm-wave and UWB CMOS 65nm SoC for radar applications\",\"authors\":\"N. Mazor, R. Wizenberg, J. Oredsson, P. Svalange, P. Lundborg, T. Melander, Z. Nadiri, N. Chayat\",\"doi\":\"10.1109/COMCAS44984.2019.8958142\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A System on Chip (SoC) solution for ultra-wideband (UWB) and mm-wave MIMO radar applications is presented. The RFIC is implemented in a standard CMOS 65 nm process, comprising 24 transmit-receive modules for UWB along with 48 transmit-receive modules for mm-wave frequencies. Targeting radar applications, the signal generation architecture supports a variety of waveforms. The receive side includes multichannel digitization, memories and DSP processor for radar signal processing. The SoC family has several variants, supporting the 76-81 GHz band for automotive industry and a 57-71 GHz band for smart home applications. The die area is 83 mm$^{2} and it is packaged in a flip-chip BGA package.\",\"PeriodicalId\":276613,\"journal\":{\"name\":\"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)\",\"volume\":\"56 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/COMCAS44984.2019.8958142\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COMCAS44984.2019.8958142","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mm-wave and UWB CMOS 65nm SoC for radar applications
A System on Chip (SoC) solution for ultra-wideband (UWB) and mm-wave MIMO radar applications is presented. The RFIC is implemented in a standard CMOS 65 nm process, comprising 24 transmit-receive modules for UWB along with 48 transmit-receive modules for mm-wave frequencies. Targeting radar applications, the signal generation architecture supports a variety of waveforms. The receive side includes multichannel digitization, memories and DSP processor for radar signal processing. The SoC family has several variants, supporting the 76-81 GHz band for automotive industry and a 57-71 GHz band for smart home applications. The die area is 83 mm$^{2} and it is packaged in a flip-chip BGA package.