采用A64FX芯片的下一代高性能计算处理器的功耗/性能/面积评估

Eishi Arima, Yuetsu Kodama, Tetsuya Odajima, Miwako Tsuji, M. Sato
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引用次数: 8

摘要

未来的高性能计算系统,包括后百亿亿次超级计算机,将面临摩尔定律减速和电力供应限制等严峻问题。为了在抵消这些问题的同时实现预期的系统性能改进,硬件设计优化是一个关键因素。在本文中,我们通过使用A64FX芯片和定制版本的功率/性能/面积模拟器(即Gem5和McPAT)来研究基于simd的处理器架构的未来方向。具体而言,基于A64FX芯片,我们首先在模拟器中定制各种能量参数,然后通过将技术节点缩小到3nm来评估功耗和面积的降低。此外,我们还研究了在功率/面积限制下,通过缩放内核数量、SIMD宽度和FP管道宽度,可以实现的3nm FLOPS改进。评估结果表明,由于内存系统瓶颈,特别是在L1数据缓存和FP寄存器文件上,没有进一步的SIMD/管道宽度扩展将有助于提高FLOPS。在此基础上,讨论了基于simd的高性能计算处理器的未来发展方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power/Performance/Area Evaluations for Next-Generation HPC Processors using the A64FX Chip
Future HPC systems, including post-exascale supercomputers, will face severe problems such as the slowing-down of Moore's law and the limitation of power supply. To achieve desired system performance improvement while counteracting these issues, the hardware design optimization is a key factor. In this paper, we investigate the future directions of SIMD-based processor architectures by using the A64FX chip and a customized version of power/performance/area simulators, i.e., Gem5 and McPAT. More specifically, based on the A64FX chip, we firstly customize various energy parameters in the simulators, and then evaluate the power and area reductions by scaling the technology node down to 3nm. Moreover, we investigate also the achievable FLOPS improvement at 3nm by scaling the number of cores, SIMD width, and FP pipeline width under power/area constraints. The evaluation result indicates that no further SIMD/pipeline width scaling will help with improving FLOPS due to the memory system bottleneck, especially on L1 data caches and FP register files. Based on the observation, we discuss the future directions of SIMD-based HPC processors.
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