电源模块可靠性评估研究综述

Shima Khoshzaman, I. Hahn
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引用次数: 1

摘要

随着工业应用对电源模块要求的不断提高,电源模块的可靠性和健康状态评估受到越来越多的关注。本文综述了传统模块封装技术的基本原理,包括基板、键合线和焊料层及其局限性。讨论了与寿命终止包相关的典型故障。此外,还对加速老化试验和常用寿命估计模型进行了综述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Survey on Reliability Assessment of Power Modules
The continuous increase in the requirements of power modules in industrial applications is the motivation to draw more attention towards reliability and the state-of-health assessment of them. The basics of conventional module packaging technology containing base plate, bond wires and solder layers and its limitations are reviewed in this paper. Typical end-of-life package-related failures are discussed. In addition, accelerated aging tests and common lifetime estimation models are reviewed.
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