MEMS失效模式及失效机制研究

Ming Zhang, Fengming Lu, Jiang Shao
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引用次数: 2

摘要

针对微机电系统(MEMS)器件的可靠性问题,通过大量的数据研究和故障信息收集,介绍了微机电系统常见的失效模式和机理。进一步分析和总结了MEMS的主要失效模式(粘附、机械断裂和磨损)及其失效机理。同时,提出了相应的预防和改进措施。研究结果对今后MEMS器件的失效分析和可靠性设计具有指导意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research on MEMS failure modes and failure mechanisms
In view of the reliability of micro electro mechanical system (MEMS) devices, the common failure modes and mechanisms of MEMS are introduced through a lot of data research and failure information collection. The key failure modes of MEMS (adhesion, mechanical fracture, and wear) and their failure mechanisms are further analyzed and summarized. Meanwhile, the corresponding prevention and improvement measures are put forward. The research results are helpful to guide the failure analysis and reliability design of MEMS devices in future.
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