Khiem Nguyen Khac, N. Knyazev, Vuong Le Quoc, Hung Luu Quang
{"title":"带通滤波器与两个l型谐振器","authors":"Khiem Nguyen Khac, N. Knyazev, Vuong Le Quoc, Hung Luu Quang","doi":"10.1109/EWDTS.2018.8524829","DOIUrl":null,"url":null,"abstract":"A microstrip band-pass filter design with two identical L-shaped resonators was studied. Signal injection and signal release is performed by using microstrip transmission lines located on the substrate, on the opposite side from the resonators. Using 3D electrodynamic modeling software, we designed a band-pass filter on a substrate with dielectric permittivity ε=2.5 and thickness h= 1.5 mm. The center frequency of the filter is 1300 MHz, and the operating frequency band is 76 MHz. The design proposed has a compact size and occupies only 50×40 = 2000 mm2. The designed filter and optimized for the necessary parameters, such as minimum bandwidth loss and best matching - can be realized using traditional PCB manufacturing methods, since it has fully technologically realizable dimensions.","PeriodicalId":127240,"journal":{"name":"2018 IEEE East-West Design & Test Symposium (EWDTS)","volume":"370 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Band-Pass Filter with Two L-Shaped Resonators\",\"authors\":\"Khiem Nguyen Khac, N. Knyazev, Vuong Le Quoc, Hung Luu Quang\",\"doi\":\"10.1109/EWDTS.2018.8524829\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A microstrip band-pass filter design with two identical L-shaped resonators was studied. Signal injection and signal release is performed by using microstrip transmission lines located on the substrate, on the opposite side from the resonators. Using 3D electrodynamic modeling software, we designed a band-pass filter on a substrate with dielectric permittivity ε=2.5 and thickness h= 1.5 mm. The center frequency of the filter is 1300 MHz, and the operating frequency band is 76 MHz. The design proposed has a compact size and occupies only 50×40 = 2000 mm2. The designed filter and optimized for the necessary parameters, such as minimum bandwidth loss and best matching - can be realized using traditional PCB manufacturing methods, since it has fully technologically realizable dimensions.\",\"PeriodicalId\":127240,\"journal\":{\"name\":\"2018 IEEE East-West Design & Test Symposium (EWDTS)\",\"volume\":\"370 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE East-West Design & Test Symposium (EWDTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EWDTS.2018.8524829\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE East-West Design & Test Symposium (EWDTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EWDTS.2018.8524829","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A microstrip band-pass filter design with two identical L-shaped resonators was studied. Signal injection and signal release is performed by using microstrip transmission lines located on the substrate, on the opposite side from the resonators. Using 3D electrodynamic modeling software, we designed a band-pass filter on a substrate with dielectric permittivity ε=2.5 and thickness h= 1.5 mm. The center frequency of the filter is 1300 MHz, and the operating frequency band is 76 MHz. The design proposed has a compact size and occupies only 50×40 = 2000 mm2. The designed filter and optimized for the necessary parameters, such as minimum bandwidth loss and best matching - can be realized using traditional PCB manufacturing methods, since it has fully technologically realizable dimensions.