全氧化物透明电荷阱存储薄膜晶体管器件设计参数研究

Da-Jeong Yun, Han-Byeol Kang, Sung‐Min Yoon
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引用次数: 0

摘要

采用In-Ga-Zn-O薄膜作为有源沟道和电荷阱层制备了电荷阱存储薄膜晶体管,并对其进行了表征。为了优化工艺条件,将设计参数分为两部分。首先,研究了双层隧道氧化物的厚度效应,并选择了5nm / 5nm结构,以保证工艺窗口和器件性能。其次,研究了CTL厚度对器件性能的影响,发现使用30 nm厚CTL的器件表现出优异的存储性能和器件均匀性。CTL几何形状也被发现对非易失性存储器操作有显著影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigations on device design parameters of all-oxide transparent charge-trap memory thin-film transistors
Charge-trap memory thin film transistors employing In-Ga-Zn-O thin films as active channel and charge-trap layers (CTLs) were fabricated and characterized. To optimize process conditions, the design parameters were categorized into two parts. First, the thickness effects of double-layered tunneling oxide were examined and the 5 nm/5 nm configuration was chosen for guaranteeing process window and device performance. Secondly, the CTL thickness effects were investigated and the device using 30 nm-thick CTL showed most desirable behaviors including superior memory operation and device uniformity. The CTL geometry was also found to have significant impact on nonvolatile memory operations.
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