标准65nm CMOS的高能效亚/近阈值纹波进位加法器

A. Vatanjou, T. Ytterdal, S. Aunet
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引用次数: 7

摘要

该手稿包括32位纹波进位加法器(“RCA”)的芯片测量,演示了电源电压(“Vdd”)低至84 mV的功能。低Vdd可能是同类CMOS电路中最低的,不依赖于特殊的施密特触发逻辑或体偏置。两个32位纹波进位加法器在65nm CMOS中实现,栅极长度分别为60nm和80nm。与60纳米的实现相比,80纳米栅极长度的实现利用了反向短通道效应(“RSCE”)等次要效应,当工作到亚阈值电源电压时,每次操作提供的能量更低。对称噪声边界的尺寸,只使用少数派3电路和逆变器,具有规则的布局,有助于超低的Vdd电位。根据模拟,基于L = 80 nm,每次操作的能量可以降低到约1.5 fJ/bit。对于20 ~ 110 ns范围内的延迟,L = 60 nm的RCA的能耗比L = 80 nm的RCA高18.5% ~ 47%。与L = 60 nm RCA相比,L = 80 nm RCA的面积减少了9.7%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Energy efficient sub/near-threshold ripple-carry adder in standard 65 nm CMOS
This manuscript includes chip measurements for a 32-bit Ripple-Carry Adder (“RCA”), demonstrating functionality for a supply voltage (“Vdd”) down to 84 mV. The low Vdd might be the lowest reported for comparable CMOS circuitry, not depending on special schmitt-trigger based logic or body biasing. Two 32-bit ripple-carry adders are implemented in 65 nm CMOS, having all gate lengths of 60 nm and 80 nm, respectively. The implementation having 80 nm gate lengths exploits secondary effects like the Reverse Short Channel Effect (“RSCE”) to provide lower energy per operation, compared to the 60 nm implementation, when operated down to subthreshold supply voltages. Dimensioning for symmetric noise margins, and using minority-3 circuits and inverters only, with regular layouts, contribute to the ultra low Vdd potential. According to simulations, the energy per operation could be down to about 1.5 fJ/bit for the implementation, based on L = 80 nm. For delays in the 20 ns to 110 ns range, the energy consumption for the RCA having L = 60 nm, was from 18.5 to 47 % higher than the RCA having L = 80 nm. The area was 9.7 % less for the L = 80 nm implementation, compared to the L = 60 nm RCA.
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