硅片粘接玻璃的性能揭示

Yicai Sun, Guofeng Pan, Linlin Li, Pange Lui
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引用次数: 0

摘要

研制了一种化学计量组成为PbO:ZnO:B/sub 2/O/sub 3/=58:18 . 24(wt%)的三元体系低温玻璃焊料,用于在玻璃衬底上焊接硅片。当焊接温度为510/spl℃时,采用熔体(900/spl℃)的淬火状态。结合后变为结晶态,其热行为与淬火态明显不同。为了阐明性能与行为之间的关系,对两种淬火态和重凝态粉末进行了DSC红外吸收光谱和x射线衍射分析。可以确定,淬火后的玻璃相软化点(450/spl℃)较低,在500/spl / sim/510/spl℃下熔透,且没有x射线衍射峰,这是玻璃相的典型光谱。而对于再冷凝玻璃,熔点提高到631/spl /644/spl℃。x射线衍射峰与Pb/sub 2/ZnB/sub 2/O/sub 6/标准谱相同。这些结果表明,再冷凝玻璃焊料具有结晶结构,有利于在较高温度下的器件使用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Property revealing for silicon chip-bonding glass
A low temperature glass solder of the ternary system with a stoichiometric composition of PbO:ZnO:B/sub 2/O/sub 3/=58:18:24(wt%) has been developed for bonding silicon chip onto a glass substrate. When bonding at 510/spl deg/C, the quenched state from its molten (900/spl deg/C) was used. After bonding, it turned into a crystalline state, whose thermal behaviour was obviously different from the quenched state. In order to illuminate the relationship between properties and behaviours, DSC infrared absorption spectroscopy and X-ray diffraction were carried out for two powders of the quenched and recondensed states. It can be confirmed that for the quenched one, the softening point (450/spl deg/C) was lower and it was melted thoroughly at 500/spl sim/510/spl deg/C for chip-bonding, and there was no X-ray diffraction peak, which is a typical spectrum for the glass phase. However, for the recondensed glass, the melting point was raised to 631/spl sim/644/spl deg/C. There were the same X-ray diffraction peaks as the standard spectrum of Pb/sub 2/ZnB/sub 2/O/sub 6/. These results indicate that the recondensed glass solder possess a crystalline structure to benefit the usage for devices at higher temperature.
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