一种新型高速高增益低噪声0.18µm工艺CMOS放大器

S. Mahdavi, F. Noruzpur, Shahram Esmaeilie, Amin Sadeghi, Arvin Mohammady
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引用次数: 0

摘要

本文介绍了一种新型的高速、高增益、低噪声的CMOS运算放大器,其内置CMFB可用于高速应用。在提出的结构中,设计采用了辅助的内部CMFB技术来增强有效跨导,从而实现高增益和高单位增益带宽(UGB)。同时,所有的晶体管都被偏置到亚阈值区域,以降低功耗。应用该方法,放大器的交流响应结果显示,直流增益为88.42dB,单位增益带宽(UGB)为1.45 GHz,相位裕度为78.2°。输出和输入参考噪声图给出的峰值分别为1.83pV/√Hz和81nV/√Hz。值得注意的是,噪声分析是在输入节点施加6mV信号的情况下进行的。为了测量ICMR,通过将放大器设置为单位增益,非反相配置和1.8V电源,模拟了所提出放大器的直流传输特性。直流传输特性几乎是轨对轨ICMR,从421µV到1.756V。同时,在1.8伏电源和1pF负载电容下,仪表放大器的总功耗为1.39mW。所提出的放大器的布局是通过使用Cadence Virtuoso设计的,放大器核心占用的有效面积只有36.05μm×13.40μm (0.483mm2)。利用180nm CMOS技术的BSIM3模型,利用HSPICE对该放大器进行了仿真。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Novel High-Speed High-Gain and Low-Noise CMOS Amplifier in 0.18µm Process
This work describes a novel high-speed, high-gain and low-noise CMOS operational amplifier with interior CMFB for high-speed applications. In the proposed structure, the design employs an auxiliary interior CMFB technique to enhance the effective transconductance and hence achieves high gain and high unity-gain bandwidth (UGB), as well. Meanwhile, all the transistors are biased to operate in sub-threshold region to decrease power consumption. Applying the proposed idea, the AC response of the amplifier shows the 88.42dB Dc gain and Unity-Gain Bandwidth (UGB) of 1.45 GHz and the phase margin of 78.2°, respectively. The output and input referred noise plot gives a peak value of 1.83pV/√Hz and 81nV/√Hz, respectively. It is notable that, the noise analysis has been performed with a 6mV signal applied at the input nodes. To measure the ICMR, the DC transfer characteristic of the proposed amplifier is simulated by setting up the amplifier in a unity-gain, non-inverting configuration with a 1.8V supply. The DC transfer characteristic almost rail-to-rail ICMR, from 421µV to 1.756V, as well. Meanwhile, at the 1.8volts power supply and load capacitance of 1pF, the overall power consumed by instrumentation amplifier is 1.39mW. The layout of the proposed amplifier is designed by using the Cadence Virtuoso, the amplifier core occupies an active area of the only 36.05μm×13.40μm (0.483mm2). The simulation results of the proposed amplifier is performed by HSPICE using the BSIM3 model of a 180nm CMOS technology.
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