M. Yasunaga, Shumpei Matsuoka, Yuya Hoshinor, Takashi Matsumoto, T. Odaira
{"title":"嵌入式芯片电容的高信号完整性pcb走线及其遗传算法设计方法","authors":"M. Yasunaga, Shumpei Matsuoka, Yuya Hoshinor, Takashi Matsumoto, T. Odaira","doi":"10.23919/ICEP.2019.8733515","DOIUrl":null,"url":null,"abstract":"Signal integrity (SI) degradation in printed circuit boards (PCBs) has been becoming more serious problem in GHz domain due to the difficulty of impedance matching designs. In this paper, we propose a novel trace structure called capacitor- segmental transmission line (C-STL) and its design methodology to overcome the SI degradation problem. In the C-STL, we intentionally generate reflection waves, or noises due to impedance mismatching by embedded chip capacitors connected to the trace, or transmission line in the PCB, and superpose the reflection waves onto the distorted digital signals to shape it to ideal ones. We use genetic algorithm to design the C-STL because chip-capacitor-selection becomes a combinatorial explosion problem. We fabricate a C-STL prototype and demonstrate its high SI improvement capability by eye-diagram measurements.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A High Signal-Integrity PCB-Trace with Embedded Chip Capacitors and Its Design Methodology Using Genetic Algorithm\",\"authors\":\"M. Yasunaga, Shumpei Matsuoka, Yuya Hoshinor, Takashi Matsumoto, T. Odaira\",\"doi\":\"10.23919/ICEP.2019.8733515\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Signal integrity (SI) degradation in printed circuit boards (PCBs) has been becoming more serious problem in GHz domain due to the difficulty of impedance matching designs. In this paper, we propose a novel trace structure called capacitor- segmental transmission line (C-STL) and its design methodology to overcome the SI degradation problem. In the C-STL, we intentionally generate reflection waves, or noises due to impedance mismatching by embedded chip capacitors connected to the trace, or transmission line in the PCB, and superpose the reflection waves onto the distorted digital signals to shape it to ideal ones. We use genetic algorithm to design the C-STL because chip-capacitor-selection becomes a combinatorial explosion problem. We fabricate a C-STL prototype and demonstrate its high SI improvement capability by eye-diagram measurements.\",\"PeriodicalId\":213025,\"journal\":{\"name\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP.2019.8733515\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733515","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A High Signal-Integrity PCB-Trace with Embedded Chip Capacitors and Its Design Methodology Using Genetic Algorithm
Signal integrity (SI) degradation in printed circuit boards (PCBs) has been becoming more serious problem in GHz domain due to the difficulty of impedance matching designs. In this paper, we propose a novel trace structure called capacitor- segmental transmission line (C-STL) and its design methodology to overcome the SI degradation problem. In the C-STL, we intentionally generate reflection waves, or noises due to impedance mismatching by embedded chip capacitors connected to the trace, or transmission line in the PCB, and superpose the reflection waves onto the distorted digital signals to shape it to ideal ones. We use genetic algorithm to design the C-STL because chip-capacitor-selection becomes a combinatorial explosion problem. We fabricate a C-STL prototype and demonstrate its high SI improvement capability by eye-diagram measurements.