了解ReRAM器件中的漏洞,以信任半导体设计

T. Schultz, R. Jha
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引用次数: 1

摘要

本文讨论了阻性随机存取存储器(ReRAM)器件中可能被木马电路触发的攻击漏洞。对基于Ru/MgO/Ti/W的ReRAM器件在1R和1T1R两种配置下进行了系统实验。我们的观察表明,ReRAM的漏洞包括由于电流过调、局部加热、寄生电容的引入以及源电压的小故障而导致的灯丝不稳定。这些研究对于设计更健壮的、不受硬件攻击的ReRAM设备至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Understanding vulnerabilities in ReRAM devices for trust in semiconductor designs
This paper discusses attack vulnerabilities in Resistive Random Access Memory (ReRAM) devices that can be potentially triggered by Trojan circuits. Systematic experiments were performed on Ru/MgO/Ti/W based ReRAM devices in 1R and 1T1R configurations. Our observations indicate that vulnerabilities in ReRAM include destabilization of filament due to current overshoot, local heating, introduction of parasitic capacitances, and glitches in the source voltages. These studies are critical to design more robust ReRAM devices that are immune to hardware attacks.
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