100 GHz以上集成单芯片收发器的潜在封装解决方案

2012 IEEE Asia-Pacific Conference on Antennas and Propagation Pub Date : 2012-10-18 DOI:10.1109/APCAP.2012.6333219

S. Beer, T. Zwick

{"title":"100 GHz以上集成单芯片收发器的潜在封装解决方案","authors":"S. Beer, T. Zwick","doi":"10.1109/APCAP.2012.6333219","DOIUrl":null,"url":null,"abstract":"This paper discusses different packaging options for integrated single-chip transceivers above 100 GHz. Multi-layer technologies, thin-film antennas and Embedded Wafer BGA packaging are shortly introduced. Using the example of a highly advanced 120-GHz monostatic Radar IC, it is then discussed which technology offers the best option to reliably package the IC.","PeriodicalId":178493,"journal":{"name":"2012 IEEE Asia-Pacific Conference on Antennas and Propagation","volume":"196 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Potential packaging solutions for integrated single-chip transceivers above 100 GHz\",\"authors\":\"S. Beer, T. Zwick\",\"doi\":\"10.1109/APCAP.2012.6333219\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses different packaging options for integrated single-chip transceivers above 100 GHz. Multi-layer technologies, thin-film antennas and Embedded Wafer BGA packaging are shortly introduced. Using the example of a highly advanced 120-GHz monostatic Radar IC, it is then discussed which technology offers the best option to reliably package the IC.\",\"PeriodicalId\":178493,\"journal\":{\"name\":\"2012 IEEE Asia-Pacific Conference on Antennas and Propagation\",\"volume\":\"196 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE Asia-Pacific Conference on Antennas and Propagation\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APCAP.2012.6333219\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Asia-Pacific Conference on Antennas and Propagation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APCAP.2012.6333219","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

本文讨论了100 GHz以上集成单片收发器的不同封装选择。简要介绍了多层技术、薄膜天线和嵌入式晶圆BGA封装。以高度先进的120 ghz单站雷达IC为例，讨论了哪种技术可以提供可靠封装IC的最佳选择。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Potential packaging solutions for integrated single-chip transceivers above 100 GHz

This paper discusses different packaging options for integrated single-chip transceivers above 100 GHz. Multi-layer technologies, thin-film antennas and Embedded Wafer BGA packaging are shortly introduced. Using the example of a highly advanced 120-GHz monostatic Radar IC, it is then discussed which technology offers the best option to reliably package the IC.

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2012 IEEE Asia-Pacific Conference on Antennas and Propagation

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