基于小波包的超声无损检测缺陷特征提取VLSI结构

Li Shoushan, Zhang Tongjun, Bi Lijun, Tao Anli
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引用次数: 0

摘要

本文旨在构建基于小波包分解的超大规模集成电路缺陷提取体系结构。讨论了无损检测中超声信号缺陷特征提取的小波包分解方法。根据分解系数在不同尺度和层次上提取的特征,确定缺陷特征提取的框架。配置了小波包分解和特征提取算法的VLSI体系结构。该体系结构在FPGA中实现。通过fpga的实现和缺陷分类实验,表明缺陷特征提取的VLSI架构为实时嵌入式可重构超声信号处理应用提供了一种实用有效的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
VLSI architecture of defect feature extraction based on wavelet packet in ultrasonic nondestructive test
This paper aims at the construction of VLSI architecture of defect extraction based on wavelet packet decomposition. The wavelet packet decomposition for defect feature extraction of ultrasonic signal in nondestructive test is discussed. Based on the features being extracted from decomposed coefficients at different scales and levels, the frame of defect feature extraction is confirmed. The VLSI architectures of wavelet packet decomposition and feature extraction algorithms are configured. The architectures are implemented in FPGA. According to the implementations in FPGAs and experiments to defects classification, the VLSI architecture of defect feature extraction provides a practical and effective solution to real-time embedded reconfigurable ultrasonic signal processing applications.
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