系统MOSFET跨导失配的表征

H. Tuinhout
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引用次数: 13

摘要

本文介绍了一种利用具有1%尺寸偏移的MOSFET对进行MOSFET跨导失配表征的研究。此外,引入了一种新的错配现象,该现象归因于与CMP假瓷砖相关的机械应变。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterisation of systematic MOSFET transconductance mismatch
This paper presents a study on MOSFET transconductance mismatch characterisation using MOSFET pairs with intentional 1% dimensional offsets. Furthermore, a new mismatch phenomenon is introduced that is attributed to mechanical strain associated with CMP dummy tiles.
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