SOI FinFET技术中sram的辐射诱导软误差分析:器件到电路的方法

S. Kiamehr, T. Osiecki, M. Tahoori, S. Nassif
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引用次数: 22

摘要

本文全面分析了采用SOI FinFET技术设计的sram的辐射诱发软误差。为此,我们提出了一种跨层方法,从FinFET结构中粒子相互作用的3D模拟开始,直到考虑存储阵列布局的电路级分析。这种方法使我们能够考虑不同因素(如电源电压和工艺变化)对FinFET SRAM存储阵列软错误率(SER)的影响。我们的分析表明,质子引起的软误差变得越来越重要,特别是在低电源电压(低功率应用)下,与α粒子引起的SER相当。此外,我们观察到α粒子辐射的多比特扰动(MBU)与单事件扰动(SEU)的比率远远高于质子辐射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Radiation-induced soft error analysis of SRAMs in SOI FinFET technology: A device to circuit approach
This paper presents a comprehensive analysis of radiation-induced soft errors of SRAMs designed in SOI FinFET technology. For this purpose, we propose a cross layer approach starting from a 3D simulation of particle interactions in FinFET structures up to circuit level analysis by considering the layout of the memory array. This approach enables us to consider the effect of different factors such as supply voltage and process variation on Soft Error Rate (SER) of FinFET SRAM memory arrays. Our analysis shows that proton-induced soft errors are becoming important and comparable to the SER induced by alpha-particles especially for low supply voltages (low power applications). Moreover, we observe that the ratio of Multiple Bit Upset (MBU) to Single Event Upset (SEU) for alpha-particle radiation is much higher than that of proton.
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