镍铬陶瓷合金的后焊工艺研究。焊接温度和气氛的影响]。

Aichi Gakuin Daigaku Shigakkai shi Pub Date : 1990-03-01
K Ishigure
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引用次数: 0

摘要

以两种镍铬陶瓷合金和一种金焊料为对象,研究了焊接温度和气氛对焊点抗拉强度的影响。每种合金和金焊料在三种不同温度和四种不同气氛下的电炉中用氟焊剂焊接。在三种不同的温度中,一种刚好超过焊料的液点,另一种比液点高50摄氏度,另一种比液点高100摄氏度。在四种不同的气氛中,一种是在真空下,另一种是在真空下,氩气流量为6l /h,另一种是在真空下,氩气流量为12l /h,另一种是在真空下,氩气流量为24l /h。在焊点处进行拉伸强度测试。用EPMA观察断口形貌。在高纯氩气中,采用固定式液滴法测定了焊料在各合金上的润湿性。在高纯氩气中,用固定式液滴法测定了氧化镁上液态焊料的表面张力和接触角。焊接是在高纯度氩气中进行的。结果总结如下:焊接温度对UNI metal焊点的抗拉强度有显著影响(p < 0.01)。而焊接气氛对拉伸强度的影响较小。焊接温度和气氛对胜利ii型焊点抗拉强度的影响较小。每种合金都有不同的适当焊接温度。随着焊接温度的升高,焊点界面扩散层的厚度增加,但气氛与扩散层厚度没有相关性。UNI金属-焊点的断裂模式为粘接-粘接混合断裂,粘接面积较大。Victory ii型焊点的断裂模式为粘接-内聚混合断裂,粘接面积较大。在严格控制的高纯度氩气气氛中,可以在无焊剂的情况下在用于固定式滴注法的炉中进行焊接。液态焊料在UNI METAL上的润湿性优于Victory II。使用的焊料在1000℃时的表面张力为505.9 dyn/cm,使用的焊料在1000℃时的接触角为163.0度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
[Study on postsoldering of Ni-Cr ceramic alloys. Effect of soldering temperature and atmosphere].

The effects of soldering temperatures and atmospheres on tensile strength of solder joints were investigated for two types of Ni-Cr ceramic alloys and one type of gold solder for postsoldering. Each alloy and the gold solder were soldered with fluoride flux in an electric furnace in three different temperatures and four different atmospheres. Of the three different temperatures, one was just over the liquidus point of the solder, another 50 degrees C higher than the liquidus point and the other 100 degrees C higher than the liquidus point. Of the four different atmospheres, one was under vacuum, another under vacuum with a 6 l/h argon gas flow, another under vacuum with a 12 l/h argon gas flow and the other under vacuum with a 24 l/h argon gas flow. Tensile strength testing was performed at the solder joints. The fracture surface was observed by EPMA. Wettability of the liquid solder on each alloy was performed by the sessile drop method in high-purity argon gas. The surface tension and the contact angle of the liquid solder on MgO were determined by the sessile drop method in high-purity argon gas. The soldering was performed in the furnace used for the sessile drop method in high-purity argon gas. The results are summarized as follows. The tensile strength of UNI METAL-solder joints was significantly affected by the soldering temperature (p less than 0.01). However, the effect of the soldering atmosphere on the tensile strength was small. The effect of the soldering temperature and atmosphere on the tensile strength of Victory II-solder joints was small. Each alloy had a different adequate soldering temperature. With the increase in the soldering temperature, the diffusion layer of the solder joint interface increased, but no correlationship between the atmosphere and the diffusion layer thickness was observed. Fracture patterns of UNI METAL-solder joints were mixed adhesive-cohesive fractures with a large cohesive area. Fracture patterns of Victory II-solder joints were mixed adhesive-cohesive fractures with a large adhesive area. It was possible to perform the soldering without flux in the furnace used for the sessile drop method in a strictly controlled atmosphere of high-purity argon gas. Wettability of the liquid solder on UNI METAL was better than on Victory II. The surface tension of the solder used was 505.9 dyn/cm at 1000 degrees C. The contact angle of the solder used was 163.0 degrees at 1000 degrees C.

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