温度感知MPSoC调度,减少热点和梯度

A. Coskun, T. Simunic, K. Whisnant, K. Gross
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引用次数: 97

摘要

模具上的热热点和温度梯度需要最小化,以制造可靠的系统,同时满足能源和性能限制。在这项工作中,我们使用整数线性规划(ILP)来解决多处理器片上系统(mpsoc)的任务调度问题。我们优化的目标是最小化热点并平衡已知任务的模具温度分布。在给定的任务特征假设下,解是最优的。我们将我们的技术与能量最小化、能量平衡和热点最小化的最佳调度方法进行了比较,并表明我们的技术获得了明显更好的热剖面。我们还扩展了我们的技术来处理运行时的工作负载变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature-aware MPSoC scheduling for reducing hot spots and gradients
Thermal hot spots and temperature gradients on the die need to be minimized to manufacture reliable systems while meeting energy and performance constraints. In this work, we solve the task scheduling problem for multiprocessor system-on-chips (MPSoCs) using Integer Linear Programming (ILP). The goal of our optimization is minimizing the hot spots and balancing the temperature distribution on the die for a known set of tasks. Under the given assumptions about task characteristics, the solution is optimal. We compare our technique against optimal scheduling methods for energy minimization, energy balancing, and hot spot minimization, and show that our technique achieves significantly better thermal profiles. We also extend our technique to handle workload variations at runtime.
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