基于电感耦合和耦合谐振器的三维集成(特邀)

2015 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) Pub Date : 2015-08-01 DOI:10.1109/RFIT.2015.7377882

Yasuhiro Take, J. Kadomoto, T. Kuroda

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引用次数: 0

摘要

本文描述了一种采用电感耦合的无线芯片间链路，即ThruChip接口(TCI)和一种采用耦合谐振器的低倾斜三维时钟分配网络。应用TCI和耦合谐振器可以通过应用传统的CMOS技术实现芯片的三维集成，而无需新的额外处理。虽然TCI的额外成本远低于通硅通孔(TSV)，但速度、功率、可靠性和可测试性不会受到影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D integration using inductive coupling and coupled resonator (Invited)

This paper describes a wireless inter-chip link using inductive coupling, namely ThruChip Interface (TCI) and a low-skew 3D clock distribution network using coupled resonator. Applying a TCI and a coupled resonator make it possible to integrate chips three dimensionally by applying conventional CMOS technology without new additional processing. Although the additional cost of a TCI is much lower than that of a through-silicon via (TSV), speed, power, reliability, and testability are not compromised.

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2015 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)

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