{"title":"数据中心并行组网中TSV周围TiN保护环串扰抑制","authors":"Alit Apriyana Anak Agung, P. Zhao, C. S. Tan","doi":"10.1109/3DIC48104.2019.9058903","DOIUrl":null,"url":null,"abstract":"This paper presents the design of TiN guard ring structure that is built around the through silicon via (TSV) to improve the signal integrity (SI) performance of parallel networking lines by suppressing the crosstalk from adjacent TSV. The guard ring enhances the insertion loss by up to 1.6 dB and the crosstalk isolation by 20-26 dB across a range of 0-40 GHz. The attainable data rate is higher than 50 Gbps under 50 Ohm load and higher than 10 Gbps under 1 pF capacitive loading. The obtained signal-to-noise ratio (SNR) is greater than 15.","PeriodicalId":440556,"journal":{"name":"2019 International 3D Systems Integration Conference (3DIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center\",\"authors\":\"Alit Apriyana Anak Agung, P. Zhao, C. S. Tan\",\"doi\":\"10.1109/3DIC48104.2019.9058903\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the design of TiN guard ring structure that is built around the through silicon via (TSV) to improve the signal integrity (SI) performance of parallel networking lines by suppressing the crosstalk from adjacent TSV. The guard ring enhances the insertion loss by up to 1.6 dB and the crosstalk isolation by 20-26 dB across a range of 0-40 GHz. The attainable data rate is higher than 50 Gbps under 50 Ohm load and higher than 10 Gbps under 1 pF capacitive loading. The obtained signal-to-noise ratio (SNR) is greater than 15.\",\"PeriodicalId\":440556,\"journal\":{\"name\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC48104.2019.9058903\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC48104.2019.9058903","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center
This paper presents the design of TiN guard ring structure that is built around the through silicon via (TSV) to improve the signal integrity (SI) performance of parallel networking lines by suppressing the crosstalk from adjacent TSV. The guard ring enhances the insertion loss by up to 1.6 dB and the crosstalk isolation by 20-26 dB across a range of 0-40 GHz. The attainable data rate is higher than 50 Gbps under 50 Ohm load and higher than 10 Gbps under 1 pF capacitive loading. The obtained signal-to-noise ratio (SNR) is greater than 15.
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