日本CMOS/BiCMOS功率放大器技术发展趋势

N. Suematsu, S. Shinjo
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引用次数: 7

摘要

针对2-5GHz频段单片收发系统,采用传统的CMOS/BiCMOS (SiGeCMOS)工艺,实现了射频部分的集成。集成功率放大器(PA)的尝试已经成功地应用于低发射功率系统,如蓝牙,但由于CMOS中FET的功率处理能力差,以及BiCMOS中BJT (HBT)的失真特性,这些尝试非常有限。本文从电路设计者的角度,回顾了日本近年来CMOS/BiCMOS放大器的研究活动,并详细介绍了(1)采用传统CMOS工艺的放大器的可行性研究,(2)BJT(HBT)放大器的降畸变电路试验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CMOS/BiCMOS power amplifier technology trend in Japan
Aiming for 2-5GHz band transceiver system on a chip, the integration of RF section has been developed by using conventional CMOS/BiCMOS (SiGeCMOS) process. The attempts to integrate power amplifiers (PA's) have been successful for low transmit power system such as Bluetooth, but these attempts are very limited due to the poor power handling capability of FET's in CMOS and the distortion characteristics of BJT's(HBT's) in BiCMOS. From the point of view of a circuit designer, this paper reviews the recent research activities of CMOS/BiCMOS PA's in Japan, and also describes the details of (1) the feasibility study of PA's using conventional CMOS process, and (2) the circuitry trials of distortion reduction for BJT(HBT) PA's.
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