砷化镉薄膜器件中的介电击穿和电铸现象

M. Din, R. D. Gould
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引用次数: 0

摘要

在这种高导电性半导体材料中,不可能区分这两种过程的开始,而且很可能这两种过程是同时开始的。电铸通常在绝缘材料中观察到(Ray和Hogarth 1984),其中在特定时刻产生的电流非常迅速地增加。在试验装置中,在场F/sub b/处观察到电流减小,这可能是介质击穿;然而,在此事件之后,样品在增加和降低电压时都表现出典型的电压控制差分负电阻(VCNR)电铸特性。本文讨论了这两种现象的基本特征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dielectric breakdown and electroforming phenomenon in the cadmium arsenide thin films devices
In this high conductivity semiconductor material, it is not possible to distinguish between the onset of these two processes, and it is highly probable that the two processes are initiated simultaneously. Electroforming is normally observed in insulating materials (Ray and Hogarth 1984), where there is a very rapid increase in the current drawn at a particular moment. In the test device, a decrease in current was observed at the field F/sub b/, which may be identified with dielectric breakdown; however, after this event the samples showed the typical electroforming characteristic of voltage-controlled differential negative resistance (VCNR) for both increasing and decreasing voltages. The basic characteristics observed for both these phenomena are discussed in the paper.
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