场发射增强型半导体热电冷却器

Technical Digest of the 17th International Vacuum Nanoelectronics Conference (IEEE Cat. No.04TH8737) Pub Date : 2004-07-11 DOI:10.1109/IVNC.2004.1354964

B. Weiss, P. H. Cutler, N. Miskovsky, M. Chung, N. Kumar

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引用次数: 0

摘要

本文报道了一种场发射增强热电冷却器原型装置的制作和测量的初步实验结果。该装置基于由聚焦离子束技术制造的硅针阵列。该装置使用电场调制电流通过n型和p型载流子将热量从冷源传输到热源。采用热电偶和光学测温法对特高压系统进行冷却测量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Field emission enhanced semiconductor thermoelectric cooler

Initial experimental results on the fabrication and measurements of a prototype field emission enhanced thermoelectric cooler device is reported. The device is based upon a silicon needle arrays fabricated by a focused ion beam technique. The device uses an electric field modulated current to transport heat from a cold source to a hot source via n- and p-type carriers. Cooling measurements are carried out in UHV system using both thermocouple and optical thermometry.

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Technical Digest of the 17th International Vacuum Nanoelectronics Conference (IEEE Cat. No.04TH8737)

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