指令封装:减少动态调度逻辑的功耗和延迟

J. Sharkey, D. Ponomarev, K. Ghose, O. Ergin
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引用次数: 28

摘要

现代超标量微处理器中使用的指令调度逻辑通常依赖于问题队列条目的关联搜索来动态唤醒指令以执行。传统的设计为每条指令使用一个问题队列条目,而不考虑唤醒过程中实际使用的操作数的数量。在本文中,我们提出了一种新的微架构技术——指令打包,它通过在两个指令之间共享一个问题队列条目的关联部分来降低问题队列的延迟和功耗,每个指令在调度时最多有一个非就绪寄存器源操作数。我们的结果表明,在模拟的SPEC基准测试中,指令打包使整个问题队列功率降低了39%,唤醒延迟降低了21.6%,IPC平均降低了0.4%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Instruction packing: reducing power and delay of the dynamic scheduling logic
The instruction scheduling logic used in modern superscalar microprocessors often relies on associative searching of the issue queue entries to dynamically wakeup instructions for the execution. Traditional designs use one issue queue entry for each instruction, regardless of the actual number of operands actively used in the wakeup process. In this paper we propose instruction packing - a novel microarchitectural technique that reduces both the delay and the power consumption of the issue queue by sharing the associative part of an issue queue entry between two instructions, each with at most one nonready register source operand at the time of dispatch. Our results show that instruction packing provides a 39% reduction of the whole issue queue power and 21.6% reduction in the wakeup delay with as little as 0.4% IPC degradation on the average across the simulated SPEC benchmarks.
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