先进的片内薄膜混合技术，集成聚酰亚胺薄膜电容器，用于超高速和毫米波应用

Proceedings RAWCON 98. 1998 IEEE Radio and Wireless Conference (Cat. No.98EX194) Pub Date : 1998-08-09 DOI:10.1109/RAWCON.1998.709149

W. Nohr, G. Hanke, D. Weber

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引用次数: 0

摘要

极高比特率(/spl ges/ 20gbit /s)或信号频率(/spl ges/ 20ghz)的处理对于先进的电信技术越来越重要。因此，适当的电路布置是必要的。微带线的频散、寄生阻抗的频率依赖性以及任意有限长度层的变换特性等问题必须得到解决。为此，开发了集成薄膜电容器片内嵌入技术。本文介绍了这种包含平面电容器和馈通电容器的薄膜混合电路的制造方法。介绍了芯片互连技术。

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Advanced chip-in-board thin film hybrid technology with integrated polyimide film capacitors for ultra high-speed and millimeter-wave applications

The processing of extreme high bit rates (/spl ges/20 Gbit/s) or signal frequencies (/spl ges/20 GHz) is of increasing importance for advanced telecommunications. Therefore a suitable circuit arrangement is necessary. Problems like frequency dispersion of microstrip lines, frequency dependence of parasitic impedances, and transforming characteristics of any finite length of layer must be solved. For this purpose a chip-in-board embedding technique with integrated film capacitors was developed. The article describes the manufacturing of such thin film hybrid circuits containing planar capacitors and feed-through capacitors. The chip interconnection technology is represented too.

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Proceedings RAWCON 98. 1998 IEEE Radio and Wireless Conference (Cat. No.98EX194)

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