{"title":"利用LECCS模型模拟IC发射来评估封装","authors":"E. Takahashi, T. Nakayama, Y. Saito","doi":"10.1109/EMCZUR.2006.214930","DOIUrl":null,"url":null,"abstract":"We applied a LECCS (linear equivalent circuit and current source) model that has been proposed as a model for EMI simulation of an LSI to evaluate package EMI characteristics. We divided the LSI into the chip part and the package part and described it using the LECCS model. We simulated the power supply current spectrum while changing the package part. The measurement results, obtained using the MP (magnetic probe) method, were compared with the simulation results. Our results confirmed that the LECCS model is valid for impact evaluation of the EMI characteristics of a package","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Evaluation of packages by simulating IC emission using a LECCS model\",\"authors\":\"E. Takahashi, T. Nakayama, Y. Saito\",\"doi\":\"10.1109/EMCZUR.2006.214930\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We applied a LECCS (linear equivalent circuit and current source) model that has been proposed as a model for EMI simulation of an LSI to evaluate package EMI characteristics. We divided the LSI into the chip part and the package part and described it using the LECCS model. We simulated the power supply current spectrum while changing the package part. The measurement results, obtained using the MP (magnetic probe) method, were compared with the simulation results. Our results confirmed that the LECCS model is valid for impact evaluation of the EMI characteristics of a package\",\"PeriodicalId\":130489,\"journal\":{\"name\":\"2006 17th International Zurich Symposium on Electromagnetic Compatibility\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 17th International Zurich Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCZUR.2006.214930\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCZUR.2006.214930","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Evaluation of packages by simulating IC emission using a LECCS model
We applied a LECCS (linear equivalent circuit and current source) model that has been proposed as a model for EMI simulation of an LSI to evaluate package EMI characteristics. We divided the LSI into the chip part and the package part and described it using the LECCS model. We simulated the power supply current spectrum while changing the package part. The measurement results, obtained using the MP (magnetic probe) method, were compared with the simulation results. Our results confirmed that the LECCS model is valid for impact evaluation of the EMI characteristics of a package
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