印刷线路板的大面积电子束直接成像技术

T. Iwami, M. Sakamoto, H. Murakami, S. Sasaki, S. Hoshinouchi
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引用次数: 1

摘要

开发了一种电子束直接成像系统,该系统可以在不使用薄膜掩模的情况下,直接从计算机辅助设计(CAD)数据中对印刷电路板(pwb)上的电路图形进行成像。该系统实现了100 mm*100 mm大视场的光束偏转。该技术可在不到1 s的时间内成像,成像精度优于+ -30 μ m,最大偏转速度为254 m/s,光束半宽直径为40 μ m,可使用与传统光刻相同的抗蚀剂。结果表明,在尺寸为340 mm*400 mm的印刷电路板上,通过拼接偏转场可以成像线宽小于100 μ m的精细图案
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Large area electron beam direct imaging technology for printed wiring boards
An electron beam direct imaging system that can image electric circuit patterns directly on printed wiring boards (PWBs) from computer-aided design (CAD) data without using film masks has been developed. The system realizes beam deflection over a large field of 100 mm*100 mm. The deflection field can be imaged in less than 1 s with an accuracy of better than +or-30 mu m. The maximum deflection speed is 254 m/s, and the beam diameter in full width at half maximum is 40 mu m. This technology can use the same kinds of resists as those for conventional photolithography. It was shown that fine patterns with line widths less than 100 mu m can be imaged for PWBs 340 mm*400 mm in size by stitching deflection fields.<>
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