激光材料加工的最新进展

V. Kovalenko
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引用次数: 1

摘要

激光技术的第一次研究是在上世纪60年代初开始的。从那时起,在不同类型的激光器的发展、对激光束与物质相互作用的理解、过程的模拟、材料加工的广泛操作的发展和各种监测工作条件的装置方面取得了巨大的成就。尽管这种动态技术在很短的历史时期内取得了独特的成果,但仍有许多问题有待解决。激光本身必须是更有效的能量转换器,波长范围必须在远红外区域和近紫外线和x射线领域扩大。激光系统必须更加紧凑和通用,配备各种各样的控制和监控设备进行加工。加工结果的快速、精确无损检测技术仍需解决发展的问题。作为激光技术最近和进一步的前景,已经有可能期待更复杂类型的激光器的出现,这些激光器有可能在大范围内改变辐射波长和脉冲持续时间。获得极短和超短脉冲,并利用它们来实现基于材料烧蚀的不同工艺,将会更简单。大功率连续波高效激光器将被开发并应用于工业。随着信息技术的广泛融合,可能会出现许多新的混合激光加工技术。在进一步的激光加工发展的主要目标将是实现更高的产品质量,在可能的低成本,在维护激光系统的改进和提高其可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Recent developments in laser material processing
First research in laser technology had been initiated at the beginning of 60th of the last century. Since then great achievements had been gained in different laser types development, understanding of laser beams interaction with matter, simulation of the processes, development of wide range of operations of material processing and different devices to monitor the working conditions. In spite of unique results obtained in very short historic period this dynamic technology has still a lot of problems to be solved. Lasers itself had to be more efficient transformers of energy, the range of wavelength had to be broaden both in far infrared region and to near ultra violet and X-ray fields. Laser systems must be more compact and versatile, equipped with the whole variety of control and monitoring devices for the processing. Still needs the solution the problem of development the fast and precise techniques for non-destruction testing of processing results. As nearest and further prospects in laser technology it is possible already to expect the advent of more sophisticated type of laser with possibilities to change in wide range both wavelength of radiation and duration of the pulses. It will be simpler to get very short and ultra short pulses and to use them for the realization of different processes based on material ablation. High power CW highly efficient laser will be developed and implemented into industry. Many new hybrid laser processing may appear with wide integration of information technologies. The main goal in further laser processing development will be the achievement of higher quality of the product at possibly lower cost, improvement in maintaining of the laser systems and increasing their reliability.
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