绕组电容联轴器概述

N. Djukic, L. Encica, J. Paulides
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引用次数: 11

摘要

使用带有变频驱动器(vfd)的电机会产生电磁干扰(EMI)。在传导电磁干扰的高频(HFs)下,由于寄生电容耦合,变频器馈电的电磁绝缘系统的阻抗很小。因此,传导的电磁干扰电流通过绝缘流入机器或地的其他导电部分。这可能导致绝缘损坏,加速腐蚀和轴承,并影响系统中其他电气和/或机械连接的设备。为了了解电磁干扰现象以及如何将其最小化,必须了解vfd -电缆-电磁系统中的寄生电容。许多作者对电缆的寄生电容和机器的承载电容进行了分析。然而,没有多少出版物集中在绕组的详细分析。在大多数情况下,绕组的寄生电容表示为全局等效RLC电路的一部分。一些作者使用简化的模型,如螺线管,这并不能充分代表在电磁环境中使用的实际绕组拓扑结构。到目前为止,对寄生电容耦合在绕组本身的实际分布,特别是对多层线圈的实际分布,还没有给予太多的关注。因此,似乎有必要对文献中提出的模型及其在EMs分析中的实施进行概述。本文从绕组拓扑和导体几何的角度,包括导体之间的绝缘涂层和导体与地的电容耦合,提出了可以在绕组等效RLC电路中实现的电容耦合,可以进一步应用于分析机器在高频下的行为。本文最后的讨论部分建议了如何在将来更准确地确定寄生电容耦合的进一步步骤。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Overview of capacitive couplings in windings
The use of electrical machines (EMs) with variable-frequency drives (VFDs) results in electromagnetic interference (EMI). At high frequencies (HFs) of conducted EMI, the impedance of an EM insulation system fed from a VFD is small due to the parasitic capacitive couplings. Thus, the conducted EMI currents flow through the insulation into the other conductive parts of the machine or ground. This can cause damage to the insulation, accelerate corrosion and bearings, and influence other electrically and/or mechanically connected equipment in the system. In order to understand the phenomena of EMI and how to minimize it, one must understand parasitic capacitances in a VFD-cable-EM system. Many authors analyze the topic of parasitic capacitances of cables and machine's bearing capacitances. However, not many publications are focused on the detailed analysis of the windings. In most cases, the parasitic capacitances of the winding are represented as a part of a global equivalent RLC circuit. Some authors use simplified models such as solenoids, which are not adequate representatives of the actual winding topologies used in EMs. To date, not much attention is given to the actual distribution of parasitic capacitive couplings in the winding itself, especially for multi-layer coils. Therefore, it appears necessary to provide an overview of the models proposed in the literature and their implementation in the analysis of EMs. This paper presents capacitive couplings from the point of view of winding topology and conductor geometry, including insulation coating between conductors, and conductor and ground, which can be implemented in the winding equivalent RLC circuit, which can further be applied to analyze the machine's behavior at HFs. The discussion section at the end of this paper recommends further steps on how to determine the parasitic capacitive couplings in the future with more accuracy.
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