CMOS DSP和微处理器内核采用光电VLSI

2000 Southwest Symposium on Mixed-Signal Design (Cat. No.00EX390) Pub Date : 2000-02-27 DOI:10.1109/SSMSD.2000.836435

F.E. Kaimilev, J. Ekman, P. Chandramani, A. Krishnamoorthy, R. Rozier

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引用次数: 1

摘要

芯片间光互连的使用可以显著提高高性能计算和信号处理系统的芯片级和系统级性能。在本文中，我们描述了我们使用光电VLSI为这些应用构建芯片组的努力。比较了采用光互连方式与传统互连方式的性能优势。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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CMOS DSP and microprocessor cores using optoelectronic VLSI

The use of inter-chip optical interconnects can lead to a dramatic increase in chip-level and system-level performance of high-performance computing and signal processing systems. In this paper, we describe our efforts to build chipsets for these applications using optoelectronic VLSI. The performance advantages of using optical interconnects are compared with the conventional approach.

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2000 Southwest Symposium on Mixed-Signal Design (Cat. No.00EX390)

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