{"title":"高压电源材料评价","authors":"W. Dunbar","doi":"10.1109/EIC.1982.7464433","DOIUrl":null,"url":null,"abstract":"Tests that distinguish encapsulation materials for high-voltage power supplies are discussed in this paper and include voltage breakdown, concentric-cylinder, and miniwound transformer evaluation. These tests all yield information on the ability of encapsulation materials to meet high-stress electrical and differential thermal requirements common to high-voltage power supplies. In addition, tests with miniwound transformers evaluate the ability of encapsulation materials to fill microvoids of intricate designs and protect the device from high-voltage and differential thermal stresses.","PeriodicalId":422317,"journal":{"name":"1982 IEEE International Conference on Electrical Insulation","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1982-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"High voltage power supply materials evaluation\",\"authors\":\"W. Dunbar\",\"doi\":\"10.1109/EIC.1982.7464433\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Tests that distinguish encapsulation materials for high-voltage power supplies are discussed in this paper and include voltage breakdown, concentric-cylinder, and miniwound transformer evaluation. These tests all yield information on the ability of encapsulation materials to meet high-stress electrical and differential thermal requirements common to high-voltage power supplies. In addition, tests with miniwound transformers evaluate the ability of encapsulation materials to fill microvoids of intricate designs and protect the device from high-voltage and differential thermal stresses.\",\"PeriodicalId\":422317,\"journal\":{\"name\":\"1982 IEEE International Conference on Electrical Insulation\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1982-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1982 IEEE International Conference on Electrical Insulation\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EIC.1982.7464433\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1982 IEEE International Conference on Electrical Insulation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EIC.1982.7464433","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Tests that distinguish encapsulation materials for high-voltage power supplies are discussed in this paper and include voltage breakdown, concentric-cylinder, and miniwound transformer evaluation. These tests all yield information on the ability of encapsulation materials to meet high-stress electrical and differential thermal requirements common to high-voltage power supplies. In addition, tests with miniwound transformers evaluate the ability of encapsulation materials to fill microvoids of intricate designs and protect the device from high-voltage and differential thermal stresses.