基于共面波导MMIC多层技术的并行耦合线带通滤波器三维建模

R. Putri, E. Sinulingga, S. Suherman
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引用次数: 0

摘要

为了准确地模拟平行耦合线带通滤波器,提出了基于单片微波集成电路(MMIC)共面波导(CPW)多层的电磁建模技术。采用三维建模技术,得到了较好的仿真结果。对平行耦合线带通滤波器设计的几种仿真步骤进行了论证和比较。基于三维建模,得到s11 -回波损耗和s21 -插入损耗分别为-22.6 dB和2.94 dB。此外,设计的平行耦合线带通滤波器具有最佳的频率响应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3D Modeling Parallel Coupled-Line Bandpass Filter Based on Coplanar Waveguide MMIC Multilayer Technology
Electromagnetic modeling technique on monolithic microwave integrated circuit (MMIC) coplanar waveguide (CPW) multilayer have been developed to accurately model the Parallel Coupled-Line Bandpass Filter. The 3D modeling technique shows the simulation results that are optimum. Several simulation steps have been demonstrated and compared on the design of Parallel Coupled-Line Bandpass Filters. Based on the 3D modeling, S11-Return Loss and S21-Insertion Loss of -22.6 dB and and 2.94 dB are obtained respectively. In addition, it is shown the best frequency response from the design of the Parallel Coupled-Line Bandpass Filter.
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