数据路径综合的广义互连模型

T. Ly, Lloyd Elwood, E. F. Girczyc
{"title":"数据路径综合的广义互连模型","authors":"T. Ly, Lloyd Elwood, E. F. Girczyc","doi":"10.1109/DAC.1990.114849","DOIUrl":null,"url":null,"abstract":"This multilevel interconnect model for VLSI data path synthesis is designed for synthesis under interconnect constraints. Two novel algorithms for dynamic interconnect allocation and interconnect synthesis are also described. The algorithms help implement the generalized interconnect model in the ELF hardware compiler.<<ETX>>","PeriodicalId":118552,"journal":{"name":"27th ACM/IEEE Design Automation Conference","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"37","resultStr":"{\"title\":\"A generalized interconnect model for data path synthesis\",\"authors\":\"T. Ly, Lloyd Elwood, E. F. Girczyc\",\"doi\":\"10.1109/DAC.1990.114849\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This multilevel interconnect model for VLSI data path synthesis is designed for synthesis under interconnect constraints. Two novel algorithms for dynamic interconnect allocation and interconnect synthesis are also described. The algorithms help implement the generalized interconnect model in the ELF hardware compiler.<<ETX>>\",\"PeriodicalId\":118552,\"journal\":{\"name\":\"27th ACM/IEEE Design Automation Conference\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-06-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"37\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"27th ACM/IEEE Design Automation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DAC.1990.114849\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th ACM/IEEE Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DAC.1990.114849","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 37

摘要

针对超大规模集成电路(VLSI)数据路径综合中互连约束条件下的综合问题,设计了多层互连模型。本文还介绍了动态互连分配和互连综合的两种新算法。这些算法有助于实现ELF硬件编译器中的通用互连模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A generalized interconnect model for data path synthesis
This multilevel interconnect model for VLSI data path synthesis is designed for synthesis under interconnect constraints. Two novel algorithms for dynamic interconnect allocation and interconnect synthesis are also described. The algorithms help implement the generalized interconnect model in the ELF hardware compiler.<>
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