比较GaAs场效应晶体管的导通击穿位点的方法

N. Ismail, N. Malbert, N. Labat, A. Touboul, J. Muraro
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引用次数: 2

摘要

利用栅极电流提取技术测量了三种技术(功率PHEMT、PHEMT和MESFET)的导通击穿位点。我们提出了导通击穿电压(BV导通状态)轨迹与反向Igs-Vgs特性之间的关系的精确理解。通过Igs-Vgs特性的比较,本研究建立了一种比较被测器件BV-on状态的方法。我们发现,对于在掐断发生冲击电离的技术,例如具有高漏极电流的PHEMT技术,导通击穿轨迹呈现明显的“指数”形状。相反,在栅极电流中具有高冲击电离分量的技术,如PPHEMT技术,其导通击穿轨迹呈“双曲线”形状。我们评估了在掐断发生冲击电离的技术,如PHEMT和PHEMT,比在开放通道发生冲击电离的技术,如MESFET,呈现出更“双曲线”形状的on-state击穿轨迹。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Methodology to compare on-state breakdown loci of GaAs FET's
On-state breakdown loci of three technologies (power PHEMT, PHEMT and MESFET) have been measured using gate-current extraction techniques. We present a precise understanding of the correlation between the on-state breakdown voltage (BV on-state) locus and the reverse Igs-Vgs characteristics. From the comparison of Igs-Vgs characteristics, this study has allowed establishing a methodology to compare BV-on state of the devices under test. We have found that for technologies with impact ionization occurring at pinch off, such as the PHEMT technology with a high leakage gate current, the on-state breakdown locus presents a pronounced "exponential" shape. On the contrary, a technology with high impact ionization component in the gate current, such as the PPHEMT technology, presents a shape of the on-state breakdown locus rather "hyperbolic". We assess that technologies with impact ionization occurring at pinch off such as the PHEMT and PPHEMT present a more "hyperbolic" shape of the on-state breakdown locus than technologies with impact ionization occurring in open channel regime such as the MESFET.
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