一种新型非易失性存储单元结构的紧凑模型开发

M. O’Shea, D. McCarthy, R. Duane, K. McCarthy, A. Concannon, A. Mathewson
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引用次数: 2

摘要

描述了一种新型闪存器件的精确SPICE兼容模型,即顶部浮栅(TFG)单元。该器件可以集成到CMOS工艺中,对标准工艺的干扰最小。该单元由Fowler Nordheim隧道编程和擦除,这是一种低功耗操作,因此符合片上系统应用的主要要求。由于电池的可变特性,为快闪存储器建立精确的模型变得复杂。在标准的快闪存储器中,当电池被编程或擦除时,电池的阈值电压和漏极电流会发生变化。在TFG情况下,阈值电压和串联电阻都在变化,这进一步使模型开发复杂化。我们的模型在整个浮栅电荷范围内都是准确的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Compact model development for a new non-volatile memory cell architecture
An accurate SPICE compatible model for a novel flash memory device, the Top Floating Gate (TFG) cell, is described. This device can be integrated into CMOS processes with minimal disruption to the standard process. The cell is programmed and erased by Fowler Nordheim tunnelling, which is a low power operation thereby complying with a major requirement of system-on-chip applications. The development of an accurate model for flash memory is complicated by the variable nature of the cell. In standard flash memory, the threshold voltage and, therefore, the drain current of the cell vary as the cell is programmed or erased. In the TFG case, both the threshold voltage and series resistance vary which further complicates the model development. Our model has been found to be accurate over the full range of floating gate charge.
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