3D打印微球在光子集成电路上的插入损耗

2019 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP) Pub Date : 2019-11-01 DOI:10.1109/avfop.2019.8908234

Rachel M. Stark, Brandon Lovelace, D. Dykes, K. Allen, Benjamin B. Yang, A. Stark, Devin K. Brown

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引用次数: 0

摘要

光子集成电路(PICs)在连接到形状/尺寸不匹配的光纤时表现出插入损耗。本文介绍了利用三维激光光刻技术在矩形PIC波导的输出面上直接打印光学微球，并与圆形光纤芯连接。

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Insertion Loss of 3D Printed Microspheres on Photonic Integrated Circuits

Photonic ICs (PICs) exhibit insertion losses when connected to an optical fiber with shape/size mismatch. This paper describes the use of 3D laser lithography to print optical microspheres directly on the output facet of rectangular PIC waveguides for connection with a circular optical fiber core.

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2019 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)

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