Yu Lu, T. Zhong, W. Hsu, S. Kim, X. Lu, J. Kan, C. Park, W. C. Chen, X. Li, X. Zhu, P. Wang, M. Gottwald, J. Fatehi, L. Seward, J. P. Kim, N. Yu, G. Jan, J. Haq, S. Le, Y. Wang, L. Thomas, J. Zhu, H. Liu, Y. Lee, R. Tong, K. Pi, D. Shen, R. He, Z. Teng, V. Lam, R. Annapragada, T. Torng, P. Wang, S. H. Kang
{"title":"功能齐全的垂直STT-MRAM宏嵌入40纳米逻辑,用于节能物联网应用","authors":"Yu Lu, T. Zhong, W. Hsu, S. Kim, X. Lu, J. Kan, C. Park, W. C. Chen, X. Li, X. Zhu, P. Wang, M. Gottwald, J. Fatehi, L. Seward, J. P. Kim, N. Yu, G. Jan, J. Haq, S. Le, Y. Wang, L. Thomas, J. Zhu, H. Liu, Y. Lee, R. Tong, K. Pi, D. Shen, R. He, Z. Teng, V. Lam, R. Annapragada, T. Torng, P. Wang, S. H. Kang","doi":"10.1109/IEDM.2015.7409770","DOIUrl":null,"url":null,"abstract":"We present for the first time a fully functional 40 nm perpendicular STT-MRAM macro (1 Mb, ×32/×64 IO) embedded into a foundry standard CMOS logic platform. We achieved target design specifications of 20 ns read access time and 20-100 ns write cycle time without redundancy repair at standard core and IO voltages. The full 1 Mb macro can be switched reliably with write pulse as short as 6 ns, which results in full-chip write power of ~ 3.2 μW/Mbps at ×64. This is the lowest eNVM write power reported at a full-chip level and about three orders of magnitude smaller than that of eFLASH. The 0.5 Mbit high-density bitcell array also demonstrates good Rp distribution and 100 % STT switching. Our results demonstrate superior power-area-feature attributes of perpendicular STT-MRAM as a best-in-class unified eNVM solution for Internet-of-Things (IOT) applications at 40 nm as well as the scalability of these advantages to 28 nm and beyond.","PeriodicalId":336637,"journal":{"name":"2015 IEEE International Electron Devices Meeting (IEDM)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"56","resultStr":"{\"title\":\"Fully functional perpendicular STT-MRAM macro embedded in 40 nm logic for energy-efficient IOT applications\",\"authors\":\"Yu Lu, T. Zhong, W. Hsu, S. Kim, X. Lu, J. Kan, C. Park, W. C. Chen, X. Li, X. Zhu, P. Wang, M. Gottwald, J. Fatehi, L. Seward, J. P. Kim, N. Yu, G. Jan, J. Haq, S. Le, Y. Wang, L. Thomas, J. Zhu, H. Liu, Y. Lee, R. Tong, K. Pi, D. Shen, R. He, Z. Teng, V. Lam, R. Annapragada, T. Torng, P. Wang, S. H. Kang\",\"doi\":\"10.1109/IEDM.2015.7409770\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present for the first time a fully functional 40 nm perpendicular STT-MRAM macro (1 Mb, ×32/×64 IO) embedded into a foundry standard CMOS logic platform. We achieved target design specifications of 20 ns read access time and 20-100 ns write cycle time without redundancy repair at standard core and IO voltages. The full 1 Mb macro can be switched reliably with write pulse as short as 6 ns, which results in full-chip write power of ~ 3.2 μW/Mbps at ×64. This is the lowest eNVM write power reported at a full-chip level and about three orders of magnitude smaller than that of eFLASH. The 0.5 Mbit high-density bitcell array also demonstrates good Rp distribution and 100 % STT switching. Our results demonstrate superior power-area-feature attributes of perpendicular STT-MRAM as a best-in-class unified eNVM solution for Internet-of-Things (IOT) applications at 40 nm as well as the scalability of these advantages to 28 nm and beyond.\",\"PeriodicalId\":336637,\"journal\":{\"name\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"62 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"56\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2015.7409770\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2015.7409770","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fully functional perpendicular STT-MRAM macro embedded in 40 nm logic for energy-efficient IOT applications
We present for the first time a fully functional 40 nm perpendicular STT-MRAM macro (1 Mb, ×32/×64 IO) embedded into a foundry standard CMOS logic platform. We achieved target design specifications of 20 ns read access time and 20-100 ns write cycle time without redundancy repair at standard core and IO voltages. The full 1 Mb macro can be switched reliably with write pulse as short as 6 ns, which results in full-chip write power of ~ 3.2 μW/Mbps at ×64. This is the lowest eNVM write power reported at a full-chip level and about three orders of magnitude smaller than that of eFLASH. The 0.5 Mbit high-density bitcell array also demonstrates good Rp distribution and 100 % STT switching. Our results demonstrate superior power-area-feature attributes of perpendicular STT-MRAM as a best-in-class unified eNVM solution for Internet-of-Things (IOT) applications at 40 nm as well as the scalability of these advantages to 28 nm and beyond.