S. Moon, Sub Han, Jung-ho Choi, Sang‐Gil Shin, Gihan Ryu, Sung‐Woong Park, Sun-Ho Song, Mordehai Margalit, E. Avni, G. Rogovsky
{"title":"用户接入网滤波器集成混合收发器的封装","authors":"S. Moon, Sub Han, Jung-ho Choi, Sang‐Gil Shin, Gihan Ryu, Sung‐Woong Park, Sun-Ho Song, Mordehai Margalit, E. Avni, G. Rogovsky","doi":"10.1109/WFOPC.2005.1462143","DOIUrl":null,"url":null,"abstract":"We demonstrated a low-cost packaging of bidirectional transceiver using filter-integrated PLC platform for subscriber access networks. An adiabatic WDM filter was optimized and designed by BPM simulation. We fabricated a bidirectional transceiver using modified multi-chip bonding scheme for flip-chip bonding of active components and V-shaped groove for optical interconnection. As a result, the optical performance of fabricated transceiver satisfied the criteria required by Ethernet passive optical network.","PeriodicalId":445290,"journal":{"name":"Proceedings of 2005 IEEE/LEOS Workshop on Fibres and Optical Passive Components, 2005.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2005-06-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Packaging of filter-integrated hybrid transceiver for subscriber access network\",\"authors\":\"S. Moon, Sub Han, Jung-ho Choi, Sang‐Gil Shin, Gihan Ryu, Sung‐Woong Park, Sun-Ho Song, Mordehai Margalit, E. Avni, G. Rogovsky\",\"doi\":\"10.1109/WFOPC.2005.1462143\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We demonstrated a low-cost packaging of bidirectional transceiver using filter-integrated PLC platform for subscriber access networks. An adiabatic WDM filter was optimized and designed by BPM simulation. We fabricated a bidirectional transceiver using modified multi-chip bonding scheme for flip-chip bonding of active components and V-shaped groove for optical interconnection. As a result, the optical performance of fabricated transceiver satisfied the criteria required by Ethernet passive optical network.\",\"PeriodicalId\":445290,\"journal\":{\"name\":\"Proceedings of 2005 IEEE/LEOS Workshop on Fibres and Optical Passive Components, 2005.\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-06-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 2005 IEEE/LEOS Workshop on Fibres and Optical Passive Components, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/WFOPC.2005.1462143\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 2005 IEEE/LEOS Workshop on Fibres and Optical Passive Components, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WFOPC.2005.1462143","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Packaging of filter-integrated hybrid transceiver for subscriber access network
We demonstrated a low-cost packaging of bidirectional transceiver using filter-integrated PLC platform for subscriber access networks. An adiabatic WDM filter was optimized and designed by BPM simulation. We fabricated a bidirectional transceiver using modified multi-chip bonding scheme for flip-chip bonding of active components and V-shaped groove for optical interconnection. As a result, the optical performance of fabricated transceiver satisfied the criteria required by Ethernet passive optical network.